SK hynix
Mass ProductionSK hynix DDR5 RDIMM 128GB
128 GB DDR5 RDIMM using 3DS TSV packaging for in-memory database, virtualization, and large-model inference nodes.
MRDIMM
Multiplexed-rank DIMM reaching 8800 MT/s effective bandwidth per module
Micron · MRDIMM
First-generation MRDIMM multiplexing two ranks to deliver 8800 MT/s to bandwidth-bound HPC and AI CPU workloads.
Product briefing
The Micron MRDIMM multiplexes two DDR5 ranks through a data buffer so the host interface runs at an effective 8800 MT/s — roughly 40% more bandwidth than a 6400 MT/s RDIMM in the same slot. Capacities scale from 32 GB to 256 GB using standard and TSV-stacked packages.
MRDIMM targets CPU-bound HPC and AI workloads where cores starve on memory bandwidth: computational fluid dynamics, weather modeling, and inference on large language models running on host processors. The module is supported on Intel Xeon 6 P-core platforms with MRDIMM-enabled memory controllers.
Data sheet
| Interface | DDR5 MRDIMM, 288-pin |
|---|---|
| Form Factor | MRDIMM |
| Capacities | 32 GB to 256 GB |
| Data Rate | 8800 MT/s effective |
| Organization | Dual-rank multiplexed, ECC |
| Voltage | 1.1 V |
| DRAM Type | Micron 1β DDR5 |
| Platform | Intel Xeon 6 (MRDIMM-enabled) |
Deployed in
Cross-reference
SK hynix
Mass Production128 GB DDR5 RDIMM using 3DS TSV packaging for in-memory database, virtualization, and large-model inference nodes.
Micron
Mass Production96 GB DDR5 RDIMM on Micron's 1β process, delivering non-binary capacity scaling for memory-bound server workloads.