SK hynix
Mass ProductionSK hynix DDR5 16Gb Component
16 Gb DDR5 DRAM component in x8/x16 organizations for OEM module manufacturing and embedded designs up to 6400 MT/s.
16 Gb
DDR4
Samsung DDR4 8Gb Component
Long-availability 8 Gb DDR4 die for embedded and networking programs
Mass ProductionLong LifecycleSamsung
Samsung · FBGA component · Image: samsung.com
8 Gb DDR4-3200 component with extended availability for networking, industrial, and consumer designs.
- Interface
- DDR4
- Form factor
- FBGA component
- Capacities
- 8 Gb
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
The 8 Gb DDR4 component remains the volume memory of embedded computing: set-top boxes, routers, printers, industrial controllers, and automotive infotainment all continue to design in DDR4. Samsung supplies the die in x8 and x16 organizations at speed bins to 3200 MT/s.
Extended production commitments matter more than peak speed in these programs, and DDR4's mature ecosystem keeps board cost and validation effort low. Industrial temperature options support -40°C to 95°C operation for outdoor and automotive-adjacent applications.
Data sheet
Specifications
| Interface | DDR4 |
|---|---|
| Density | 8 Gb |
| Organization | x8, x16 |
| Data Rate | 2666–3200 MT/s |
| Voltage | 1.2 V |
| Package | FBGA |
| Operating Temp | 0°C to 95°C (industrial: -40°C to 95°C) |
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