SK hynix
Mass ProductionSK hynix DDR5 24Gb Component
24 Gb DDR5 component on SK hynix's 1b-nm node, the die behind 48 GB and 96 GB non-binary module capacities.
24 GbNon-binary
DDR5
SK hynix DDR5 16Gb Component
16 Gb DDR5 component for module and embedded board designs
Mass ProductionSK hynix
SK hynix · FBGA component · Image: skhynix.com
16 Gb DDR5 DRAM component in x8/x16 organizations for OEM module manufacturing and embedded designs up to 6400 MT/s.
- Interface
- DDR5
- Form factor
- FBGA component
- Capacities
- 16 Gb
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
The 16 Gb DDR5 component is the building block of mainstream DDR5 modules and down-soldered embedded designs. SK hynix supplies the die in x8 and x16 organizations across standard speed bins to 6400 MT/s, with on-die ECC and decision-feedback equalization improving signal integrity at high data rates.
For embedded and networking OEMs, component-level sourcing enables memory-down layouts on routers, switches, and controller boards where DIMM sockets are impractical. Standard FBGA packaging and JEDEC-compliant timings simplify qualification across multiple board programs.
Data sheet
Specifications
| Interface | DDR5 |
|---|---|
| Density | 16 Gb |
| Organization | x8, x16 |
| Data Rate | 4800–6400 MT/s |
| Voltage | 1.1 V |
| Package | FBGA |
| Features | On-die ECC, DFE |
| Operating Temp | 0°C to 95°C |
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