SK hynix
Mass ProductionSK hynix DDR5 16Gb Component
16 Gb DDR5 DRAM component in x8/x16 organizations for OEM module manufacturing and embedded designs up to 6400 MT/s.
9 products · 4 lines
DDR, LPDDR, and GDDR die and packaged components for OEM and embedded designs
Component-level DRAM for board-level integration: DDR5 and DDR4 for compute, LPDDR5X and LPDDR4X for mobile and automotive, and GDDR7 and GDDR6 for graphics and accelerator designs.
SKUs in this index
DDR5 components in 16 Gb to 32 Gb densities for module and embedded designs.
SK hynix
Mass Production16 Gb DDR5 DRAM component in x8/x16 organizations for OEM module manufacturing and embedded designs up to 6400 MT/s.
SK hynix
Mass Production24 Gb DDR5 component on SK hynix's 1b-nm node, the die behind 48 GB and 96 GB non-binary module capacities.
Samsung
Sampling32 Gb DDR5 die enabling 128 GB modules without TSV stacking, targeting high-capacity server memory.
DDR4 components for legacy platforms and long-availability embedded programs.
Samsung
Mass Production8 Gb DDR4-3200 component with extended availability for networking, industrial, and consumer designs.
Low-power DRAM for smartphones, thin clients, automotive, and edge devices.
SK hynix
Mass ProductionLPDDR5X at 8533 Mbps per pin in packages up to 16 GB, powering flagship smartphones and edge AI devices.
Samsung
Mass ProductionSamsung LPDDR5X in 12 nm-class process, shipping at 8533 Mbps with 10.7 Gbps grades sampling for AI-era devices.
Samsung
Mass ProductionLPDDR4X at 4266 Mbps with automotive temperature grades, the volume choice for IVI, telematics, and mid-range devices.
High-bandwidth graphics DRAM for GPUs, accelerators, and network processors.
SK hynix
Sampling16 Gb GDDR7 using PAM3 signaling at 32 Gbps and above, for next-generation graphics cards and AI inference accelerators.
Samsung
Mass Production16 Gb GDDR6 at 16–24 Gbps per pin, the shipping standard for graphics cards, consoles, and high-throughput FPGAs.
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Registered, unbuffered, and multiplexed DIMMs for server, workstation, and client platforms
UFS, eMMC, and multichip packages for mobile, automotive, and IoT designs
NVMe and SATA SSDs from data center to client and portable