7 products · 3 lines

Mobile & Embedded

UFS, eMMC, and multichip packages for mobile, automotive, and IoT designs

Managed NAND and multichip solutions: UFS 4.0 and 3.1 for flagship and mid-range mobile, eMMC 5.1 for cost-optimized and automotive designs, and uMCP/eMCP packages combining LPDDR and managed NAND in one footprint.

SKUs in this index

UFS

3 PRODUCTS

Universal Flash Storage for smartphones, automotive, and embedded compute.

SK hynix

Mass Production

SK hynix ZUFS 4.0

UFS 4.0 with zoned storage management, holding sequential reads above 4,000 MB/s while reducing long-term fragmentation.

256 GB512 GB1 TBZonedFlagship

Samsung

Mass Production

Samsung UFS 4.0

UFS 4.0 managed NAND with up to 4,200 MB/s reads and double the power efficiency of UFS 3.1, in capacities to 1 TB.

256 GB512 GB1 TBFlagship

Samsung

Mass Production

Samsung UFS 3.1

UFS 3.1 managed NAND at up to 2,100 MB/s reads, the volume storage tier for mid-range phones and automotive IVI.

128 GB256 GB512 GBAutomotive

eMMC

2 PRODUCTS

e.MMC 5.1 managed NAND for cost-sensitive and long-lifecycle designs.

Samsung

Mass Production

Samsung eMMC 5.1

e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.

8 GB16 GB32 GB64 GBLong Lifecycle

SK hynix

Mass Production

SK hynix eMMC 5.1

e.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.

16 GB32 GB64 GB128 GBIndustrial

MCP

2 PRODUCTS

Multichip packages combining LPDDR DRAM with UFS or eMMC storage.

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