SK hynix
Mass ProductionSK hynix ZUFS 4.0
UFS 4.0 with zoned storage management, holding sequential reads above 4,000 MB/s while reducing long-term fragmentation.
7 products · 3 lines
UFS, eMMC, and multichip packages for mobile, automotive, and IoT designs
Managed NAND and multichip solutions: UFS 4.0 and 3.1 for flagship and mid-range mobile, eMMC 5.1 for cost-optimized and automotive designs, and uMCP/eMCP packages combining LPDDR and managed NAND in one footprint.
SKUs in this index
Universal Flash Storage for smartphones, automotive, and embedded compute.
SK hynix
Mass ProductionUFS 4.0 with zoned storage management, holding sequential reads above 4,000 MB/s while reducing long-term fragmentation.
Samsung
Mass ProductionUFS 4.0 managed NAND with up to 4,200 MB/s reads and double the power efficiency of UFS 3.1, in capacities to 1 TB.
Samsung
Mass ProductionUFS 3.1 managed NAND at up to 2,100 MB/s reads, the volume storage tier for mid-range phones and automotive IVI.
e.MMC 5.1 managed NAND for cost-sensitive and long-lifecycle designs.
Samsung
Mass Productione.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
SK hynix
Mass Productione.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.
Multichip packages combining LPDDR DRAM with UFS or eMMC storage.
SK hynix
Mass ProductionUFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
Samsung
Mass ProductioneMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.
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