Samsung
Mass ProductionSamsung eMCP (LPDDR4X + eMMC)
eMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.
3+32 GB4+64 GB8+128 GBMCP
MCP
SK hynix uMCP (LPDDR5X + UFS)
LPDDR5X DRAM and UFS storage combined in a single mobile package
Mass ProductionMCPSK hynix
SK hynix · uMCP BGA · Image: skhynix.com
UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
- Interface
- LPDDR5X + UFS 3.1
- Form factor
- uMCP BGA
- Capacities
- 8+128 GB12+256 GB16+512 GB
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
The uMCP stacks LPDDR5X DRAM and UFS managed NAND in one package, cutting board footprint and simplifying routing for mid-range and slim smartphone designs. Combinations pair 8 to 16 GB of LPDDR5X with 128 to 512 GB of UFS 3.1 storage.
Single-package sourcing also consolidates procurement and qualification: one part number covers the memory subsystem. SK hynix supplies uMCP across consumer temperature grades with power characteristics tuned for battery-first duty cycles.
Data sheet
Specifications
| Interface | LPDDR5X + UFS 3.1 |
|---|---|
| Form Factor | uMCP BGA |
| DRAM | 8 GB / 12 GB / 16 GB LPDDR5X |
| Storage | 128 GB / 256 GB / 512 GB UFS |
| DRAM Data Rate | Up to 8533 Mbps/pin |
| Storage Read | Up to 2,100 MB/s |
| Operating Temp | -25°C to 85°C |
Deployed in
Cross-reference
Related products
SK hynix
Mass ProductionSK hynix LPDDR5X
LPDDR5X at 8533 Mbps per pin in packages up to 16 GB, powering flagship smartphones and edge AI devices.
8 GB12 GB16 GB8533 Mbps
SK hynix
Mass ProductionSK hynix ZUFS 4.0
UFS 4.0 with zoned storage management, holding sequential reads above 4,000 MB/s while reducing long-term fragmentation.
256 GB512 GB1 TBZonedFlagship