SK hynix
Mass ProductionSK hynix uMCP (LPDDR5X + UFS)
UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
8+128 GB12+256 GB16+512 GBMCP
MCP
Samsung eMCP (LPDDR4X + eMMC)
LPDDR4X and eMMC in one package for entry mobile and IoT devices
Mass ProductionMCPSamsung
Samsung · eMCP BGA · Image: samsung.com
eMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.
- Interface
- LPDDR4X + e.MMC 5.1
- Form factor
- eMCP BGA
- Capacities
- 3+32 GB4+64 GB8+128 GB
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
The eMCP combines LPDDR4X DRAM with eMMC 5.1 managed NAND in a single BGA, the standard memory solution for entry smartphones, feature-rich wearables, and connected consumer devices. Typical configurations pair 3 to 8 GB of DRAM with 32 to 128 GB of storage.
One-package integration reduces board area, layer count, and assembly cost — decisive factors at entry price points. Samsung's vertical NAND and DRAM supply supports stable volume availability across long consumer product cycles.
Data sheet
Specifications
| Interface | LPDDR4X + e.MMC 5.1 |
|---|---|
| Form Factor | eMCP BGA (11.5 x 13 mm) |
| DRAM | 3 GB / 4 GB / 6 GB / 8 GB LPDDR4X |
| Storage | 32 GB / 64 GB / 128 GB eMMC |
| DRAM Data Rate | Up to 4266 Mbps/pin |
| Storage Read | Up to 250 MB/s |
| Operating Temp | -25°C to 85°C |
Deployed in
Cross-reference
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