SK hynix
Mass ProductionSK hynix eMMC 5.1
e.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.
16 GB32 GB64 GB128 GBIndustrial
eMMC
Samsung eMMC 5.1
Cost-optimized managed NAND for entry mobile, IoT, and automotive designs
Mass ProductionLong LifecycleSamsung
Samsung · 153-ball FBGA · Image: samsung.com
e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
- Interface
- e.MMC 5.1
- Form factor
- 153-ball FBGA
- Capacities
- 8 GB16 GB32 GB64 GB128 GB256 GB
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
eMMC 5.1 is the workhorse managed-NAND interface for entry smartphones, tablets, set-top boxes, smart TVs, and countless embedded designs. Samsung's parts run HS400 mode at up to 250 MB/s sequential read with capacities from 8 GB to 256 GB.
The integrated controller handles wear leveling, bad-block management, and ECC, letting host SoCs use simple MMC interfaces without NAND management burden. Automotive and industrial temperature grades extend the line into telematics, cluster, and factory applications.
Data sheet
Specifications
| Interface | e.MMC 5.1, HS400 |
|---|---|
| Form Factor | 153-ball FBGA (11.5 x 13 mm) |
| Capacities | 8 GB to 256 GB |
| Sequential Read | Up to 250 MB/s |
| Sequential Write | Up to 125 MB/s |
| NAND Type | Samsung V-NAND TLC / MLC options |
| Features | Command queue, RPMB, secure erase |
| Temp Grades | Consumer, industrial, automotive |
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