Samsung
Mass ProductionSamsung eMMC 5.1
e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
8 GB16 GB32 GB64 GBLong Lifecycle
eMMC
SK hynix eMMC 5.1
Second-source e.MMC 5.1 with industrial and automotive temperature grades
Mass ProductionIndustrialSK hynix
SK hynix · 153-ball FBGA · Image: skhynix.com
e.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.
- Interface
- e.MMC 5.1
- Form factor
- 153-ball FBGA
- Capacities
- 16 GB32 GB64 GB128 GB256 GB
Enquire about this product Datasheet — coming soon
Product briefing
On the record.
SK hynix's eMMC 5.1 line covers 16 GB to 256 GB capacities in the standard 153-ball FBGA, running HS400 at up to 250 MB/s reads. For hardware programs, it provides pin-compatible second-sourcing against other eMMC vendors, reducing single-supplier risk.
Industrial grades rated -40°C to 85°C and automotive-oriented screening serve gateways, HMI panels, medical devices, and vehicle telematics. Firmware supports power-loss protection for data-at-rest integrity in systems subject to abrupt power removal.
Data sheet
Specifications
| Interface | e.MMC 5.1, HS400 |
|---|---|
| Form Factor | 153-ball FBGA (11.5 x 13 mm) |
| Capacities | 16 GB to 256 GB |
| Sequential Read | Up to 250 MB/s |
| Sequential Write | Up to 120 MB/s |
| NAND Type | SK hynix 3D TLC |
| Features | Power-loss protection, RPMB |
| Temp Grades | -25°C to 85°C; industrial -40°C to 85°C |
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